Bonding Support - Altera Cyclone V Device Handbook

CV-52006
2014.01.10
Numbers of MPFE Ports Per Device
Table 6-15: Numbers of MPFE Command, Write-Data, and Read-Data Ports for Each Cyclone V Device
Variant
Cyclone V E
Cyclone V GX
Cyclone V GT

Bonding Support

Note: Bonding is supported only for hard memory controllers configured with one port. Do not use the
bonding configuration when there is more than one port in each hard memory controller.
You can bond two hard memory controllers to support wider data widths.
If you bond two hard memory controllers, the data going out of the controllers to the user logic is synchro-
nized. However, the data going out of the controllers to the memory is not synchronized.
The bonding controllers are not synchronized and remain independent with two separate address buses and
two independent command buses. These buses are calibrated separately.
If you require ECC support for a bonded interface, you must implement the ECC logic external to the hard
memory controllers.
Note: A memory interface that uses the bonding feature has higher average latency. Bonding through the
core fabric will also cause a higher latency.
External Memory Interfaces in Cyclone V Devices
Send Feedback
Member Code
Command
A2
A4
A5
A7
A9
C3
C4
C5
C7
C9
D5
D7
D9
Numbers of MPFE Ports Per Device
MPFE Ports
Write-data
4 2
4 2
6 4
6 4
6 4
4 2
6 4
6 4
6 4
6 4
6 4
6 4
6 4
6-33
Read-data
2
2
4
4
4
2
4
4
4
4
4
4
4
Altera Corporation