Designing for High Frequency Operation
Jitter should be kept to an absolute minimum. High frequency jitter on
the clock to the processor may result in abbreviated internal cycles.
FREQUENCY 1
Figure 15-5. Reducing Clock Jitter and Ring
Never share a clock buffer IC with a signal of a different clock fre-
quency. This introduces excessive jitter.
As shown in
Figure
different frequencies as physically separate as possible. The clock supplied
to the processor must have a rise time of 3 ns or less and must meet or
exceed a high and low voltage of 2 V and 0.4 V, respectively.
Other Recommendations and Suggestions
• Use more than one ground plane on the PCB to reduce crosstalk.
Be sure to use lots of vias between the ground planes. One V
plane for each supply is sufficient. These planes should be in the
center of the PCB.
• To reduce crosstalk, keep critical signals such as clocks, strobes,
and bus requests on a signal layer next to a ground plane and away
from or layout perpendicular to other non-critical signals.
• If possible, position the processors on both sides of the board to
reduce area and distances.
• To allow better control of impedance and delay, and to reduce
crosstalk, design for lower transmission line impedances.
15-16
CLOCK
15-5, keep the portions of the system that operate at
ADSP-2126x SHARC Processor Hardware Reference
a
ADSP-2126x
S
DD
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