Table of Contents
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Section 1 Overview
Module/
Classification
Function
High-
FSI
performance
interface
communication
(FSI)
CIR
interface
(CIR)
I/O ports
Package
Operating frequency/
Power supply voltage
Operating peripheral
temperature (°C)
Rev. 1.00 May 09, 2008 Page 6 of 954
REJ09B0462-0100
Description
•
One channel
•
Supports communications between this LSI and SPI flash
memory
•
Capable of operating as a master
•
Supports LPC reset and LPC shut-down
•
One channel
•
Selectable from four sampling clocks: three internal clocks and
subclock
•
18-byte FIFO incorporated
•
Input-only pins: 13 pins
•
Input/output pins: 112 pins
•
76 pull-up
•
40 pins with LED drive capability
•
32 on-chip noise cancelers
•
144-pin thin QFP package (PTQP0144LC-A)
(old code: TFP-144V, package dimensions: 16 × 16 mm, pin
pitch: 0.40 mm)
•
176-pin BGA package (PLBG0176GA-A)
(old code: BP-176V, package dimensions: 13 × 13 mm, pin
pitch: 0.80 mm)
•
145-pin TLP package (PTLG0145JB-A)
(package dimensions: 9 × 9 mm, pin pitch: 0.65 mm)
•
Lead- (Pb-) free version
•
Operating frequency: 8 to 25 MHz
•
Power supply voltage: Vcc = 3.0 to 3.6 V, AVcc = 3.0 to 3.6 V
•
Supply current:
25 mA (typ.) (Vcc = 3.3 V, AVcc = 3.3 V, φ = 25 MHz)
•
−20 to +75°C (regular specifications)
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