Table of Contents
Advertisement
18.8.4
Timing Sequence at Power-On ......................................................................... 581
18.9
Sleep Instruction Exception Handling .............................................................................. 582
18.10 Bφ Clock Output Control.................................................................................................. 585
18.11 Usage Notes ...................................................................................................................... 586
18.11.1 I/O Port Status................................................................................................... 586
18.11.2 Current Consumption during Oscillation Settling Standby Period ................... 586
18.11.3 DTC Module Stop............................................................................................. 586
18.11.4 On-Chip Peripheral Module Interrupts ............................................................. 586
18.11.5 Writing to MSTPCRA, MSTPCRB, and MSTPCRC....................................... 586
Section 19 List of Registers............................................................................... 587
19.1
Register Addresses (Address Order)................................................................................. 588
19.2
Register Bits ..................................................................................................................... 597
19.3
Register States in Each Operating Mode .......................................................................... 607
Section 20 Electrical Characteristics ................................................................. 617
20.1
Absolute Maximum Ratings ............................................................................................. 617
20.2
DC Characteristics ............................................................................................................ 618
20.3
AC Characteristics ............................................................................................................ 621
20.3.1
Clock Timing .................................................................................................... 622
20.3.2
Control Signal Timing ...................................................................................... 624
20.3.3
Bus Timing ....................................................................................................... 625
20.3.4
Timing of On-Chip Peripheral Modules ........................................................... 640
20.4
A/D Conversion Characteristics ....................................................................................... 644
20.5
D/A Conversion Characteristics ....................................................................................... 645
Appendix ............................................................................................................. 647
Port States in Each Pin State............................................................................................. 647
Product Lineup.................................................................................................................. 650
Package Dimensions ......................................................................................................... 651
Treatment of Unused Pins................................................................................................. 652
Main Revisions and Additions in this Edition..................................................... 655
Index ................................................................................................................... 661
Rev.2.00 Jun. 28, 2007 Page xxii of xxii
Advertisement
Table of Contents
