Figure H.3 Bonding Pad Form - Renesas H8/3847R Series Hardware Manual

Appendix H Form of Bonding Pads
The form of the bonding pads for the HCD64F38347, HCD64F38447, H8/38347 Group (Mask
ROM version), and H8/38447 Group (Mask ROM version) is shown in figure H.3.
Metal Layer
Bonding area
5 µm
65 µm

Figure H.3 Bonding Pad Form

Rev. 6.00 Aug 04, 2006 page 676 of 680
REJ09B0145-0400