Appendix H Form Of Bonding Pads; Figure H.1 Bonding Pad Form - Renesas H8/3847R Series Hardware Manual

Appendix H Form of Bonding Pads

Appendix H Form of Bonding Pads
The form of the bonding pads for the HCD6433847R, HCD6433846R, HCD6433845R,
HCD6433844R, HCD6433843R, and HCD6433842R is shown in figure H.1.
Bonding area
Metal Layer
90 µm 5 to 8 µm

Figure H.1 Bonding Pad Form

Rev. 6.00 Aug 04, 2006 page 674 of 680
REJ09B0145-0400