Table 1.4 Bonding Pad Coordinates Of Hcd64F38347 And Hcd64F38447 - Renesas H8/3847R Series Hardware Manual

Table 1.4 Bonding Pad Coordinates of HCD64F38347 and HCD64F38447
Pad No. Pad Name
1 P1 /TMOW
0
2 P1 /TMOFL
1
3 P1 /TMOFH
2
4 P1 /TMIG
3
5 P1 /IRQ
4
6 P1 /IRQ
5
7 P1 /IRQ
6
8 P1 /IRQ
7
9 X
1
10 X
2
11 V
SS
12 V
SS
13 OSC
2
14 OSC
1
15 TEST
RES
16
17 P2 /SCK
0
18 P2 /SI
1
19 P2 /SO
2
20 P2
3
21 P2
4
22 P2
5
23 P2
6
24 P2
7
25 P3 /PWM
0
26 P3 /UD/EXCL
1
27 P3
2
28 P3 /SCK
3
29 P3 /RXD
4
30 P3 /TXD
5
31 P3 /AEVH
6
/ADTRG
4
/TMIC
1
2
/TMIF
3
1
1
1
31
31
31
Coordinates*
X (µm)
-2056
-2056
-2056
-2056
-2056
-2056
-2056
-2056
-2056
-2056
-2056
-2056
-2056
-2056
-2056
-2056
-2056
-2056
-2056
-2056
-2056
-2056
-2056
-2056
-2056
-2056
-1777
-1530
-1382
-1280
-1178
Rev. 6.00 Aug 04, 2006 page 23 of 680
Section 1 Overview
Y (µm)
1570
1360
1259
1158
941
839
737
635
533
431
329
193
106
20
-66
-244
-402
-574
-747
-919
-1091
-1263
-1349
-1521
-1607
-1779
-2295
-2295
-2295
-2295
-2295
REJ09B0145-0600