Figure 1.6 Bonding Pad Location Diagram Of Hcd64F38347 And Hcd64F38447 (Top View) - Renesas H8/3847R Series Hardware Manual

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Figure 1.6 Bonding Pad Location Diagram of HCD64F38347 and HCD64F38447
Rev. 6.00 Aug 04, 2006 page 22 of 680
REJ09B0145-0600
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(0, 0)
Voltage level on the back of the chip : GND
(Top View)
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Chip size : 4.35mm × 4.83mm
Type code
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: NC Pad