UM-WI-006
DA16200 H/W Design Guide
4
PCB Layout Example
4.1
Grounding
●
Make the internal ground area as solid as possible. Do not break the ground into pieces
●
Provide good solid ground by using multiple vias
●
Fill as much ground as possible in the area between the walls of shield cavities and the outline of
the RF section
●
Connect each ground pin or via to the ground plane individually
●
Put the Ground via on the PAD of the QFN package
User Manual
CFR0012
Figure 23: Ground Vias on PAD
Revision 1.5
38 of 44
NDA Confidential
11-Apr-2022
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