Renesas H8/3847R Series Hardware Manual page 31

Figure G.4 Chip Sectional Figure ........................................................................................ 673
Appendix H Form of Bonding Pads
Figure H.1 Bonding Pad Form............................................................................................. 674
Figure H.2 Bonding Pad Form............................................................................................. 675
Figure H.3 Bonding Pad Form............................................................................................. 676
Appendix I Specifications of Chip Tray
Figure I.1 Specifications of Chip Tray............................................................................... 677
Figure I.2 Specifications of Chip Tray............................................................................... 678
Figure I.3 Specifications of Chip Tray............................................................................... 679
Figure I.4 Specifications of Chip Tray............................................................................... 680
Rev. 6.00 Aug 04, 2006 page xxix of xxxvi