Figure H.2 Bonding Pad Form - Renesas H8/3847R Series Hardware Manual

Appendix H Form of Bonding Pads
The form of the bonding pads for the HCD6433847S, HCD6433846S, HCD6433845S, and
HCD6433844S is shown in figure H.2.
Bonding area
Metal Layer
75 µm 2.5 µm

Figure H.2 Bonding Pad Form

Rev. 6.00 Aug 04, 2006 page 675 of 680
REJ09B0145-0600