Table 1.3 Bonding Pad Coordinates Of H8/3847S Group (Mask Rom Version) - Renesas H8/3847R Series Hardware Manual

Section 1 Overview
Table 1.3 Bonding Pad Coordinates of H8/3847S Group (Mask ROM Version)
Pad No. Pad Name
1 P1 /TMOW
0
2 P1 /TMOFL
1
3 P1 /TMOFH
2
4 P1 /TMIG
3
5 P1 /IRQ
4
6 P1 /IRQ
5
7 P1 /IRQ
6
8 P1 /IRQ
7
9 X
1
10 X
2
11 V
SS
12 OSC
2
13 OSC
1
14 TEST
RES
15
16 P2 /SCK
0
17 P2 /SI
1 1
18 P2 /SO
2
19 P2
3
20 P2
4
21 P2
5
22 P2
6
23 P2
7
24 P3 /PWM
0
25 P3 /UD
1
26 P3 /RESO
2
27 P3 /SCK
3
28 P3 /RXD
4
29 P3 /TXD
5
30 P3 /AEVH
6
Rev. 6.00 Aug 04, 2006 page 18 of 680
REJ09B0145-0600
/ADTRG
4
/TMIC
1
2
/TMIF
3
1
1
31
31
31
Coordinates*
X (µm)
-1655
-1655
-1655
-1655
-1655
-1655
-1655
-1655
-1655
-1655
-1655
-1655
-1655
-1655
-1655
-1655
-1655
-1655
-1655
-1655
-1655
-1655
-1655
-1655
-1655
-1580
-1357
-1178
-1093
-992
Y (µm)
1260
999
799
629
451
334
226
122
37
-48
-138
-223
-308
-393
-478
-563
-648
-733
-818
-903
-988
-1073
-1158
-1243
-1480
-1605
-1605
-1605
-1605
-1605