Appendix H Form Of Bonding Pads - Renesas H8/38024 Hardware Manual

Appendix H Form of Bonding Pads

The form of the bonding pads for the HCD64338024, HCD64338023, HCD64338022,
HCD64338021, HCD64338020, HCD64F38024, HCD64F38024R, HCD64338024S,
HCD64338023S, HCD64338022S, HCD64338021S, and HCD64338020S is shown in figure H.1.
72 mm
Figure H.1 Bonding Pad Form
Bonding area
Metal layer
5 mm
Rev. 6.00, 08/04, page 625 of 628