Figure 1.4 Bonding Pad Location Diagram Of H8/3847R Group (Mask Rom Version) (Top View) - Renesas H8/3847R Series Hardware Manual

Section 1 Overview
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Figure 1.4 Bonding Pad Location Diagram of H8/3847R Group (Mask ROM Version)
Rev. 6.00 Aug 04, 2006 page 12 of 680
REJ09B0145-0600
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(0, 0)
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Voltage level on the back of the chip : GND
(Top View)
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Type code
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Chip size : 6.10mm × 6.23mm
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: NC Pad