Table 1.5 Bonding Pad Coordinates Of H8/38347 Group (Mask Rom Version) And H8/38447 Group (Mask Rom Version) - Renesas H8/3847R Series Hardware Manual

Section 1 Overview
Table 1.5 Bonding Pad Coordinates of H8/38347 Group (Mask ROM Version)
and H8/38447 Group (Mask ROM Version)
Pad No. Pad Name
1 P1 /TMOW
0
2 P1 /TMOFL
1
3 P1 /TMOFH
2
4 P1 /TMIG
3
5 P1 /IRQ
4
6 P1 /IRQ
5
7 P1 /IRQ
6
8 P1 /IRQ
7
9 X
1
10 X
2
11 V
SS
12 OSC
2
13 OSC
1
14 TEST
RES
15
16 P2 /SCK
0
17 P2 /SI
1 1
18 P2 /SO
2
19 P2
3
20 P2
4
21 P2
5
22 P2
6
23 P2
7
24 P3 /PWM
0
25 P3 /UD/EXCL
1
26 P3
2
27 P3 /SCK
3
28 P3 /RXD
4
29 P3 /TXD
5
30 P3 /AEVH
6
Rev. 6.00 Aug 04, 2006 page 28 of 680
REJ09B0145-0600
/ADTRG
4
/TMIC
1
2
/TMIF
3
1
1
31
31
31
Coordinates*
X (µm)
-1658
-1658
-1658
-1658
-1658
-1658
-1658
-1658
-1658
-1658
-1658
-1658
-1658
-1658
-1658
-1658
-1658
-1658
-1658
-1658
-1658
-1658
-1658
-1658
-1658
-1629
-1300
-1202
-1103
-1005
Y (µm)
1349
1191
1104
1006
907
751
653
555
456
358
232
88
-11
-113
-212
-393
-491
-590
-688
-786
-884
-983
-1081
-1168
-1337
-1767
-1767
-1767
-1767
-1767