Figure 1.5 Bonding Pad Location Diagram Of H8/3847S Group (Mask Rom Version) - Renesas H8/3847R Series Hardware Manual

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Base type code
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Figure 1.5 Bonding Pad Location Diagram of H8/3847S Group (Mask ROM Version)

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Y
(0, 0)
41 42
Voltage level on the back of the chip : GND
(Top View)
Section 1 Overview
79 78 77
Type code
X
43 44 45 46 47 48 49
: NC Pad
Chip size : 3.55mm × 3.45mm
Rev. 6.00 Aug 04, 2006 page 17 of 680
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REJ09B0145-0600