Via Under E-Pad - Renesas R9A02G011 Application Note

R9A02G011 Board Design Guide

1.2 Via under E-pad

Make φ 0.3 mm via under E-pad as following pattern.
Figure 1-2 Via under E-pad
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BCD-ISG-19-5034 Rev.1.0 Page 4 of 17
Apr 04, 2019