Figure 1.7 Bonding Pad Location Diagram Of H8/38347 Group (Mask Rom Version) - Renesas H8/3847R Series Hardware Manual

Base type code
100
Type code
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26 27 28 29 30 31 32 33 34 35 36 37

Figure 1.7 Bonding Pad Location Diagram of H8/38347 Group (Mask ROM Version)

and H8/38447 Group (Mask ROM Version) (Top View)
99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77
(0, 0)
Voltage level on the back of the chip : GND
Y
X
38 39 40 41 42 43 44 45 46 47 48 49 50
Chip size : 3.55mm × 3.77mm
Rev. 6.00 Aug 04, 2006 page 27 of 680
Section 1 Overview
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REJ09B0145-0600