Motorola ColdFire MCF5281 User Manual page 41

Table
Number
29-10 DBMR Field Descriptions ........................................................................................ 29-13
29-11 Access Size and Operand Data Location .................................................................. 29-13
29-12 PBR Field Descriptions ............................................................................................ 29-14
29-13 PBMR Field Descriptions ......................................................................................... 29-14
29-14 TDR Field Descriptions ............................................................................................ 29-15
29-15 Receive BDM Packet Field Description ................................................................... 29-19
29-16 Transmit BDM Packet Field Description ................................................................. 29-19
29-17 BDM Command Summary ....................................................................................... 29-20
29-18 BDM Field Descriptions ........................................................................................... 29-21
29-19 Control Register Map................................................................................................ 29-32
29-20 Definition of DRc Encoding-Read......................................................................... 29-36
29-21 DDATA[3:0]/CSR[BSTAT] Breakpoint Response.................................................. 29-37
29-22 PST/DDATA Specification for User-Mode Instructions.......................................... 29-40
29-23 PST/DDATA Specification for MAC Instructions................................................... 29-43
29-24 PST/DDATA Specification for Supervisor-Mode Instructions................................ 29-44
30-1 Signal Properties ........................................................................................................ 30-3
30-2 Write-Once Bits Read/Write Accessibility................................................................. 30-4
30-3 Chip Configuration Module Memory Map................................................................. 30-4
30-4 CCR Field Descriptions .............................................................................................. 30-5
30-5 RCON Field Descriptions ........................................................................................... 30-6
30-6 RCSC Chip Select Configuration ............................................................................... 30-7
30-7 BOOTPS Port Size Configuration .............................................................................. 30-7
30-8 CIR Field Description ................................................................................................. 30-8
30-9 Reset Configuration Pin States During Reset ............................................................. 30-9
30-10 Configuration During Reset....................................................................................... 30-9
30-11 Chip Configuration Mode Selection ......................................................................... 30-11
30-12 Output Pad Driver Strength Selection ...................................................................... 30-11
30-13 Clock Mode Selection............................................................................................... 30-12
31-1 Signal Properties ......................................................................................................... 31-3
31-2 Pin Function Selected ................................................................................................. 31-3
31-3 Signal State to the Disable Module............................................................................. 31-4
31-4 IDCODE Register Field Descriptions......................................................................... 31-6
31-5 JTAG Instructions....................................................................................................... 31-8
32-1 MCF5282 Signal Description by Pin Number............................................................ 32-3
32-2 Orderable Part Numbers ............................................................................................. 32-7
33-1 Absolute Maximum Ratings, ..................................................................................... 33-1
33-2 Thermal Characteristics .............................................................................................. 33-3
33-3 DC Electrical Specifications ....................................................................................... 33-4
33-4 PLL Electrical Specifications ..................................................................................... 33-6
33-5 QADC Absolute Maximum Ratings........................................................................... 33-7
33-6 QADC Electrical Specifications (Operating) ............................................................ 33-7
33-7 QADC Conversion Specifications (Operating) .......................................................... 33-9
33-8 SGFM Flash Program and Erase Characteristics........................................................ 33-9
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