Package Dimensions; Figure C.1 Package Dimensions (Tfp-144) - Renesas H8S/2111B Hardware Manual

C.

Package Dimensions

For package dimensions, dimensions described in Renesas Semiconductor Packages Data Book
have priority.
108
109
144
1
0.18 ± 0.05
*
0.16 ± 0.04
*Dimension including the plating thickness
Base material dimension
18.0 ± 0.2
16
73
72
37
36
0.07 M
1.0
0.08

Figure C.1 Package Dimensions (TFP-144)

1.0
0.5 ± 0.1
Package Code
JEDEC
EIAJ
Weight (reference value)
Rev. 1.00, 05/04, page 539 of 544
Unit: mm
0 ˚ – 8 ˚
TFP-144
—
Conforms
0.6 g