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Figure 1.7 Bonding Pad Location Diagram of HCD64338024S, HCD64338023S,
HCD64338022S, HCD64338021S, and HCD64338020S (Top View)
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(0.0)
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Chip size: 2.91 mm × 2.91 mm
Voltage level on the back of the chip: GND
Rev. 6.00, 08/04, page 17 of 628
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