Appendix E List of Product Codes
................................................................................. 616
Appendix F Package Dimensions
................................................................................... 619
Appendix G Specifications of Chip Form
..................................................................... 623
Appendix H Form of Bonding Pads
................................................................................ 625
Appendix I Specifications of Chip Tray
...................................................................... 626
Rev. 6.00, 08/04, page xxix of xxx