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Figure 1.6 Bonding Pad Location Diagram of HCD64F38024, HCD64F38024R (Top View)
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(0, 0)
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Type code
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Chip size: 3.84 mm × 4.24 mm
Voltage level on the back of the chip: GND
: NC pad
Rev. 6.00, 08/04, page 15 of 628
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