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Figure 1.5 Bonding Pad Location Diagram of HCD64338024, HCD64338023,
HCD64338022, HCD64338021, and HCD64338020 (Top View)
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(0, 0)
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Type code
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Chip size: 3.99 mm × 3.99 mm
Voltage level on the back of the chip: GND
Rev. 6.00, 08/04, page 13 of 628
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