Renesas F-ZTAT H8 Series Hardware Manual page 38

1. Overview
Coordinates*
Pad
No. Pad Name X (μm) Y (μm)
102 COM23/SEG50 3348
103 COM22/SEG51 3348
104 COM21/SEG52 3348
105 COM20/SEG53 3348
106 COM19/SEG54 3348
107 COM18/SEG55 3348
108 COM17/SEG56 3348
109 V5OUT 2776
110 V4OUT 2616
111 V3OUT 2456
112 V2OUT 2296
113 V1OUT 2136
114 V 1976
4
115 V 1816
34
116 V 1656
3
Notes: 1. Numbers indicate coordinates at the center of the pad area, with an accuracy of ±5 μm.
The origin is the center of the chip, and the center is at a point halfway between pads,
horizontally and vertically.
2. NC1 to NC4 are test pads; they should be left open.
Rev.3.00 Jul. 19, 2007 page 12 of 532
REJ09B0397-0300
1
Pad
No. Pad Name
1731 117 V
ci
2063 118 C –
2
2223 119 C +
2
2383 120 C –
1
2543 121 C +
1
2703 122 VLOUT
2863 123 V
LCD
3463 124 V
SS
3463 125 P3
7
3463 126 P3
6
3463 127 P3
5
3463 128 P3
4
3463 129 P3
3
3463 130 P3 /SO
2 1
3463 131 P3 /Sl
1 1
1
Coordinates*
Pad
X (μm) Y (μm) No. Pad Name
1471 3463 132 P3
0
1341 3463 133 P1
7
1125 3463 134 P1
6
925 3463 135 P1
5
747 3463 136 P1
4
569 3463 137 P1
3
395 3463 138 P1
2
226 3463 139 P1
1
74 3463 140 P1
0
−78
3463 141 P4
3
−234
3463 142 P4
2
−386
3463 143 P4
1
−538
3463 144 P4
0
−690
3463
−848
3463
Coordinates*
X (μm) Y (μm)
−982
/SCK 3463
1
−1116
/IRQ /TMIF 3463
3
−1250
/IRQ /TMIC 3463
2
−1383
/IRQ /TMIB 3463
1
−1611
/PWM 3463
−1761
3463
−1911
/TMOFH 3463
−2045
/TMOFL 3463
−2180
/TMOW 3463
−2447
/IRQ 3463
0
−2587
/TXD 3463
−2737
/RXD 3463
−2888
/SCK 3463
3
1