Specifications; Technical Specifications - Polycom SoundStructure C16 Design Manual

Specifications

Technical Specifications

Dimensions
● 19" (483 mm) W x 13.5" (343 mm) L x 1.75" (45 mm) H (one rack unit)
Weight
● 12 lbs. (5.5 kg) dry, 14 lbs. (6.4 kg) shipping
Connectors
● RS-232: DB9F
● OBAM In/Out: IEEE 1394B
● CLINK2: RJ45
● LAN: RJ45
● Control/Status: DB25F
● Audio: Mini (3.5 mm) quick connect terminal blocks
● IR Receive: Mini (3.5 mm) quick connect terminal block
Power
● Internal power supply
● Input voltage of 90-250 VAC; 50-60 Hz
● Line power requirements (including 0.6 PF): 130 VA (C16), 115 VA (C12), 105 VA (SR12), 95 VA (C8)
Thermal
● Thermal Dissipation (Btu/hr): 266 Btu/hr (C16), 230 Btu/hr (C12), 215 Btu/hr (SR12), 200 Btu/hr (C8)
● Operating temperature 0 - 40° C (104° F)
Operating temperature ranges for the three thermal sensors located on the SoundStructure device are
shown in the following table. These sensor values are found on the Wiring page within SoundStructure
Studio when connected to a SoundStructure device. Green indicates normal operation up to the
temperatures listed in the following table. Yellow indicates an elevated temperature that is acceptable but
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