Keithley 4200-SCS Reference Manual page 1526

Appendix H: Suss MicroTec PA-200 Prober
Step a. Aligning the wafer
• Enter Point 1 and Point 2 distances from the center using specific X die size multiples
(Figure
to move four die to the left and also the right at 54.292mm (4 • 13.573 mm = 54.292 mm).
• Check the following boxes: Automatically move chuck to each point; Automatically turn
on chuck vacuum
• Click Begin.
Figure H-23
Aligning the wafer: Step a.
Step b. Aligning the wafer
• Move to Point 1 (left of center die align pad and pins)
• Select Continue (Step b1) to start the Alignment Wizard.
• Manually align pins and pads (POINT 1).
• Select Continue (from POINT 1) and move 8 die (for this example) to the right (Step b2).
• Manually align pins and pads (POINT 2) and select finish (Step b3).
H-18
H-23). In other words, if the die size is: X = 13.573 mm, and Y = 14.818 mm, set up
(Figure H-23).
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Model 4200-SCS Reference Manual
(Figure H-24).
4200-901-01 Rev. S / May 2017