Keithley 4200-SCS Reference Manual page 1525

Semiconductor characterization system
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Model 4200-SCS Reference Manual
2.
3.
4.
5.
Figure H-21
Setup pull-down
6.
Figure H-22
WaferMap home die selection
NOTE:
7.
8.
4200-901-01 Rev. S / May 2017
Place wafer on chuck.
Use chuck pull-down and turn on vacuum.
Manually move the wafer to the Home Die.
Select Home Die from the Setup pull-down
Choose the desired home die on the WaferMap
When choosing the home die:
The wafer should be on the chuck and physically in the correct HOME position.
Click the die on the wafer map GUI that will be the home die.
A cross-hair appears when a die has been selected as the home die.
Select Align Theta from the Chuck pull-down.
Align wafer using the following four steps:
Return to
(Figure
Section Topics
Appendix H: Suss MicroTec PA-200 Prober
H-21).
(Figure
H-22).
H-17

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