30
Device Description
3.3
Connectors
3.3.1
Data Contacts/Internal Bus
Do not place the I/O modules on the gold spring contacts!
Do not place the I/O modules on the gold spring contacts in order to avoid soiling
or scratching!
Ensure that the environment is well grounded!
The devices are equipped with electronic components that may be destroyed by
electrostatic discharge. When handling the devices, ensure that the environment
(persons, workplace and packing) is well grounded. Avoid touching conductive
components, e.g. data contacts.
Communication between the controller and the I/O modules and system power
supply for the I/O modules is provided via the internal data bus, which consists of
6 data contacts designed as self-cleaning gold spring contacts.
Figure 3: Data Contacts
Manual
Draft version 1.2.1 from 2017-09-13, valid from FW Version 02.06.20(09)
WAGO-I/O-SYSTEM 750
750-8207 PFC200 CS 2ETH RS 3G