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Handling of light (for bare chip mounting)
The characteristics of semiconductor components can vary when exposed to light. ICs may
malfunction or non- volatile memory data may be corrupted if ICs are exposed to light.
Consider the following precautions for circuit boards and products in which this IC is mounted to
prevent IC malfunctions attributable to light exposure.
Design and mount the product so that the IC is shielded from light during use.
(1)
Shield the IC from light during inspection processes.
(2)
Shield the IC on the upper, underside, and side faces of the IC chip.
(3)
Mount the IC chip within one week of opening the package. If the IC chip must be stored
(4)
before mounting, take measures to ensure light shielding.
Adequate evaluations are required to assess nonvolatile memory data retention characteristics
(5)
before product delivery if the product is subjected to heat stress exceeding regular reflow
conditions during mounting processes.
Unused pins
I/O port (P) pins
(1)
Unused pins should be left open. The control registers should be fixed at the initial status.
OSC1, OSC2, OSC3, OSC4, and EXOSC pins
(2)
If the OSC1 oscillator circuit, OSC3 oscillator circuit or EXOSC input circuit is not used, the
OSC1 and OSC2 pins, the OSC3 and OSC4 pins, or the EXOSC pin should be left open. The
control registers should be fixed at the initial status (disabled).
Memory display controller pins
(3)
If the memory display controller is not used, the memory display controller pins should
be left open. However, an external power voltage must be supplied to the V
control registers should be fixed at the initial status. The unused pins that are not required to
connect should be left open even if the memory display controller is used.
Miscellaneous
Minor variations over time may result in electrical damage arising from disturbances in the form of
voltages exceeding the absolute maximum rating when mounting the product in addition to
physical damage. The following factors can give rise to these variations:
Electromagnetically-induced noise from industrial power supplies used in mounting reflow,
(1)
reworking after mounting, and individual characteristic evaluation (testing) processes
Electromagnetically-induced noise from a solder iron when soldering
(2)
In particular, during soldering, take care to ensure that the soldering iron GND (tip potential) has the
same potential as the IC GND.
S1C31D50 TECHNICAL MANUAL
(Rev. 1.00)
Seiko Epson Corporation
pin. The
MDL
26-5
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