Platform Power Delivery Guidelines
11.10.
Thermal Design Power
The thermal design power is the estimated maximum possible expected power generated in a component
by a realistic application. It is based on extrapolations in both hardware and software technology over
the life of the product. It does not represent the expected power generated by a power virus. The thermal
design power number for the Intel 855PM MCH and Intel 82801DBM ICH4-M are listed below.
Table 86. Intel 855PM MCH Component Thermal Design Power
Intel 855PM MCH
Table 87. Intel 82801DBM ICH4-M Component Thermal Design Power
Intel 82801DBM ICH4-M - Thermal Design Power Consumption Dissipation (estimated)
Intel 82801DBM ICH4-M
270
Intel 855PM MCH - Thermal Design Power Consumption Dissipation (estimated)
1.8 W (maximum)
2.0 W (maximum)
®
Intel
855PM Chipset Platform Design Guide
R