Intel 855PM Design Manual page 9

Chipset platform for use with pentium m and celeron m processors
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11.3.1.
11.4.
11.4.1.
11.4.2.
11.4.3.
11.5.
DDR Power Delivery Design Guidelines .....................................................................254
11.5.1.
11.5.2.
11.5.3.
11.5.4.
11.5.5.
11.5.6.
11.6.
Clock Driver Power Delivery Guidelines......................................................................263
11.7.
Decoupling Recommendations....................................................................................265
11.7.1.
11.7.2.
11.7.3.
11.7.4.
11.7.5.
11.7.6.
11.7.7.
11.7.8.
11.7.9.
11.8.
Intel 855PM MCH Power Consumption Numbers .......................................................268
11.9.
Intel 82801DBM ICH4-M Power Consumption Numbers ............................................269
11.10. Thermal Design Power ................................................................................................270
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12.
PRO/Wireless 2100 and Bluetooth Design Requirements .............................................271
12.1.
PCB Interface Requirements .......................................................................................271
12.2.
DC Power Requirements for Bluetooth .......................................................................271
12.3.
Selective Suspend Support .........................................................................................272
12.4.
Wake on Bluetooth Requirements ...............................................................................272
12.5.
and Bluetooth Devices.................................................................................................272
13.
Reserved, NC, and Test Signals ..............................................................................................273
13.1.
13.2.
Intel 855PM MCH RSVD Signals.................................................................................274
14.
Platform Design Checklist ........................................................................................................275
14.1.
General Information .....................................................................................................275
14.2.
Customer Implementation............................................................................................276
14.3.
Design Checklist Implementation ................................................................................276
14.4.
Intel Pentium M Processor and Intel Celeron M Processor..........................................277
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Intel
855PM Chipset Platform Design Guide
Power Management States..........................................................................248
11.4.1.1.
3.3/1.5 V and 3.3/1.8 V Power Sequencing..................................251
11.4.1.2.
V
/ 3.3 V Sequencing................................................................251
11.4.1.3.
V
Design Guidelines .........................................................251
Intel 855PM MCH Power Sequencing Requirements..................................253
DDR Power Sequencing Requirements ......................................................253
DDR Interface Decoupling Guidelines .........................................................255
11.5.1.1.
11.5.1.2.
2.5-V Power Delivery Guidelines .................................................................255
DDR Reference Voltage...............................................................................256
11.5.3.1.
SMVREF Design Recommendations............................................259
11.5.3.2.
DDR VREF Requirements ............................................................261
DDR SMRCOMP Resistive Compensation .................................................262
DDR VTT Termination..................................................................................262
11.5.6.1.
11.5.6.2.
VTT Rail Power Up Sequencing During Resume .........................263
Processor Decoupling Guidelines................................................................265
Intel 855PM MCH Decoupling Guidelines....................................................265
Intel 82801DBM ICH4-M Decoupling Guidelines.........................................265
DDR VTT High Frequency and Bulk Decoupling.........................................267
AGP Decoupling...........................................................................................267
Hub Interface Decoupling.............................................................................267
FWH Decoupling ..........................................................................................267
General LAN Decoupling .............................................................................267
CK-408 Clock Driver Decoupling .................................................................268
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