Power Plane Splits; Thermal Design Power; Power Plane Split Example - Intel VC820 - Desktop Board Motherboard Design Manual

6.2

Power Plane Splits

Figure 6-4
Figure 6-4. Power Plane Split Example
6.3

Thermal Design Power

The thermal design power is the estimated maximum possible expected power generated in a
component by a realistic application. It is based on extrapolations in both hardware and software
technology over the life of the product. It does not represent the expected power generated by a
power virus. Refer to the Intel
for the thermal measurement methodology.
The thermal design power numbers for the MCH, MTH, and the ICH are listed in
®
Table 6-1. Intel 820 Chipset Component Thermal Design Power
Component
®
Intel 820 Chipset Design Guide
shows an EXAMPLE of the power plane splits on an Intel
®
820 Chipset Application Note: Thermal Design Considerations,
Thermal Design Power (133/400 MHz)
MCH
MTH
ICH
System Design Considerations
®
820 chipset platform.
3.5W ±15%
2.5W ±15%
1.3W ±15%
Table 6-1.
6-7