Table of Contents
Advertisement
Intel® Server Board M50CYP2SB Family Technical Product Specification
3.1.1
Processor Cooling Requirements
For the server system to support optimal operation and long-term reliability, the thermal management
solution of the selected server chassis must dissipate enough heat generated from within the chassis to keep
the processors and other system components within their specified thermal limits.
For optimal operation and long-term reliability, processors within the 3
rd
Gen Intel® Xeon® Scalable
processor family must operate within their defined minimum and maximum case temperature (T
) limits.
CASE
Refer to the 3
rd
Gen Intel® Xeon® Processor Scalable Family – Thermal Mechanical Specifications and Design
Guide for additional information concerning processor thermal limits.
Note: It is the responsibility of the system and components architects to ensure compliance with the
processor thermal specifications. Compromising processor thermal requirements will impact the processor
performance and reliability.
Disclaimer: Intel server boards contain and support several high-density VLSI and power delivery
components that need adequate airflow to cool and remain within their thermal operating limits. Intel
ensures through its own chassis development and testing that when an Intel server board and Intel chassis
are used together, the fully integrated system meets the thermal requirements of these components. It is the
responsibility of the system architect or system integrator who chooses to develop their own server system
using an Intel server board and a non-Intel chassis, to consult relevant specifications and datasheets to
determine thermal operating limits and necessary air flow to support intended system configurations and
workloads when the system is operating within target ambient temperature limits. It is also their
responsibility to perform adequate environmental validation testing to ensure reliable system operation.
Intel cannot be held responsible if components fail or the server board does not operate correctly when
published operating and non-operating limits are exceeded.
3.2
Processor Thermal Design Power (TDP) Support
To allow optimal operation and long-term reliability, the processor must remain within the defined minimum
and maximum case temperature (T
) specifications. Thermal solutions not designed to provide sufficient
CASE
thermal capability may affect the long-term reliability of the processor and system. The server board
rd
described in this document is designed to support the 3
Gen Intel® Xeon® Scalable processor family TDP
guidelines up to and including 270 W.
Note: The maximum supported processor TDP at the system level may be lower than what the server board
can support. Supported power, thermal, and configuration limits of the chosen server chassis need to be
considered to determine if the system can support the maximum processor TDP limit of the server board.
Refer to the server chassis/system documentation for additional guidance.
35
Advertisement
Table of Contents
