Table of Contents
Advertisement
6
Thermal Specifications and
Design Guidelines
6.1
Thermal Specification Overview
The processor is a Multi-Chip Package (MCP), meaning it has integrated multiple silicon
devices onto the processor substrate. These devices include the processor (CPU) die,
eight Multi-Chip DRAMs (MCDRAMs) and, in some configurations, a networking (or
fabric) controller die. See
components on the processor package, there will be a single Integrated Heat Spreader
(IHS) on the MCP which serves as an interface to the system thermal solution.
The MCP requires the thermal solution to maintain die temperatures within the
specified operating limits for all devices in the MCP. Any attempt to operate the
processor or other die outside these limits may result in permanent damage to the
processor and potentially other components within the system. Maintaining the proper
thermal environment is key to optimal and reliable, long-term processor and system
operation.
A complete thermal solution includes both component- and system-level thermal
management features. Component-level thermal solutions can include active or passive
heatsinks attached to the processors' IHS. Typical system-level thermal solutions may
consist of system fans combined with ducting and venting.
6.1.1
Thermal Design Power (TDP) and T
Table 6-1
different processor SKUs, under both CPU- and memory-centric workloads.
.
Table 6-1.
TDP and T
IOP Fabric Die Power
CPU Die Maximum T
MCDRAM Die Maximum T
Fabric Die Maximum T
Notes:
1.
Memory-centric workloads: CPU T
2.
CPU-centric workloads: Memory T
3.
Fabric die T
all workloads, as long as the thermal solution provides adequate cooling to the CPU and MCDRAM die.
4.
ASHRAE thermal envelopes allow scenarios where the data center ambient temperature may drop below
°
5
C, down to 0
once operational. Contact your Intel representative if you believe your data center implementation
warrants further consideration of minimum operational temperatures down to 0
®
®
Intel
Xeon
Phi™ Processor x200 Product Family TMSDG
42
Figure 2-1
and
Table 6-2
list the Thermal Design Power (TDP) and T
Specifications - 215W/230W SKUs
CASE
Workload
CPU Centric
CPU Power
185W
Memory Power
Total Power
82
CASE
N/A
CASE
CASE
Minimum T
4
CASE
CASE
CASE
targets: The fabric die is expected to remain below it's maximum allowable temperature for
CASE
°
C. However, the processor silicon temperatures are expected to quickly rise above 5
Thermal Specifications and Design Guidelines
and
Figure
2-2. Although there are multiple
CASE
Processor
Memory Centric
147W
30W
68W
N/A
215W
°
1
C
N/A
2
72 °C
N/A
is expected to be lower than the maximum CPU T
is expected to be lower than the maximum memory T
Specifications
values for the
CASE
Processor with Fabric
CPU Centric
Memory Centric
185W
147W
30W
68W
15W
230W
°
84
C
N/A
2
N/A
75 °C
N/A
3
°
5
C
target.
CASE
CASE
°
C.
Order Number: 334785-002
1
target.
°
C
Advertisement
Table of Contents
