Thermal Specifications; Thermal Design Power; Maximum Allowed Component Temperature; Thermal Specifications For The Intel ® Core™2 Duo Processor - Intel CORE 2 DUO MOBILE - THERMAL DESIGN GUIDE 6-2008 Design Manual

Thermal Specifications—Core™ 2 Duo Mobile Processors
3.0

Thermal Specifications

3.1

Thermal Design Power

The Thermal Design Power (TDP) specification is listed in
FCBGA, micro-FCPGA package and socket via the base board is negligible. The cooling capacity
without a thermal solution is also minimal, so Intel requires the use of a heatsink for all usage
conditions.
3.2

Maximum Allowed Component Temperature

The device must maintain a maximum temperature at or below the value specified in
thermal solution is required to meet the temperatures specification while dissipating the Thermal
Design Power.
Table 2. Thermal Specifications for the Intel
CPU
Intel® Core™ 2 Duo
Mobile Processors
on 45-nm process
=
June 2008
Order Number: 320028-001
®
Processor SKU#
Standard Voltage (Core 2 Duo-6M, Celeron-2M)
Low Voltage (Core 2 Duo -3M)
Ultra Low Voltage (Core 2 Duo -2M, Celeron)
Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications
Table 2. Heat transfer through the micro-
Core™2 Duo processor
TDP (W)
35
17
10
Table 2. The
T T
J-MAX J-MIN
(°C) (°C)
105 0
TDG
10