Intel 855PM Design Manual page 10

14.4.1.
14.4.2.
14.4.3.
14.4.4.
14.5. CK-408 Clock Checklist............................................................................................... 290
14.5.1.
14.5.2.
14.6. Intel 855PM MCH Checklist ........................................................................................ 293
14.6.1.
14.6.2.
14.6.3.
14.6.4.
14.6.5.
14.6.6.
14.7. AGP Interface .............................................................................................................. 303
14.7.1.
14.8. ICH4-M Checklist ........................................................................................................ 306
14.8.1.
14.8.2.
14.8.3.
14.8.4.
14.8.5.
14.8.6.
14.8.7.
14.8.8.
14.8.9.
14.8.10. RTC Circuitry ............................................................................................... 317
14.8.11. LAN Interface............................................................................................... 319
14.8.12. Primary IDE Interface .................................................................................. 320
14.8.13. IDE Interface (Secondary IDE Connector) .................................................. 321
14.8.14. Miscellaneous Signals ................................................................................. 322
14.8.15. ICH4-M Power Signals & Decoupling Recommendations .......................... 323
14.9. USB Checklist ............................................................................................................. 324
14.9.1.
14.9.2.
14.10. FWH Checklist............................................................................................................. 325
14.10.1. Resistor Recommendations ........................................................................ 325
14.10.2. Decoupling Recommendations.................................................................... 325
14.11. LAN / HomePNA Checklist.......................................................................................... 326
14.11.1. LAN Interface (82562ET / 82562EM) .......................................................... 326
15. Intel Customer Reference Board Schematics.......................................................................... 329
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Resistor Recommendations ........................................................................ 277
In Target Probe (ITP)................................................................................... 284
14.4.2.1. ITP700FLEX Connector
14.4.2.2. ITP Interposer
14.4.2.3. Required Strapping when ITP Debug Port Disable
Thermal Sensor ........................................................................................... 288
Decoupling Recommendations.................................................................... 288
Resistor Recommendations ........................................................................ 290
CK-408 Decoupling Recommendation ........................................................ 292
System Memory........................................................................................... 293
14.6.1.1. MCH System Memory Interface ................................................... 293
14.6.1.2. DDR SO-DIMM Interface.............................................................. 296
Miscellaneous Signals ................................................................................. 298
Resistive Compensation.............................................................................. 300
Decoupling Recommendations (MCH)........................................................ 301
Memory Decoupling Recommendation ....................................................... 301
MCH Reference Voltage.............................................................................. 302
Resistor Recommendations ........................................................................ 303
14.7.1.1. AGP Connector ............................................................................ 304
14.7.1.2. AGP Decoupling Recommendations............................................ 304
14.7.1.3. AGP VREF Reference Voltage Dividers ...................................... 304
ICH4-M Resistor Recommendations........................................................... 306
GPIO ............................................................................................................ 308
AGP Busy/Stop Design Requirements ........................................................ 309
System Management Bus (SMBus) Interface ............................................. 310
AC '97 Interface ........................................................................................... 311
ICH4-M Power Management Interface ........................................................ 312
FWH/LPC Interface...................................................................................... 314
USB Interface .............................................................................................. 314
Hub Interface ............................................................................................... 315
14.8.9.1. Hub Interface Resistor Recommendations .................................. 315
14.8.9.2. Reference Voltage Dividers.......................................................... 315
Resistor Recommendations ........................................................................ 324
Decoupling Recommendations.................................................................... 325
14.11.1.1. Resistor Recommendations ......................................................... 326
14.11.1.2. Decoupling Recommendations .................................................... 327
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Intel 855PM Chipset Platform Design Guide
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