TDT RZ2 Manual page 522

System 3 series. rz z series
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13-4
Grounding the Electrode
The images below show the possible connections made for reference or ground
wires. These wires are attached at TDT.
Caution! The ZIF resin (no-aluminum shroud) microwire arrays can be
damaged by extreme heat. Use caution when soldering.
ZIF‐Clip® Based Microwire Array Specifications
Specifications might vary based on custom order:
n Rows X n Electrodes
Metal
Wire Diameter
Insulation
Electrode Type
Flex Ribbon Site Specification
ZIF-Clip® Based Microwire Arrays
Specification
2X8
Tungsten
50 μm
Polyimide
Standard
Attached
Default
Max channels per connector = 64
33 μm
Flex Ribbon
Separated
System 3
Options

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