Zif-Clip® Based Microwire Arrays - TDT RZ2 Manual

13-3
ZIF‐Clip® Based Microwire Arrays
ZIF-Clip® microwire arrays are made to user specifications. All arrays use polyimide-
insulated tungsten microwire which yield excellent recording characteristics and ample
rigidity to facilitate insertion.
The standard ZIF2010 resin form factor array consists of sixteen channels configured
in two rows of eight electrodes each. The ZIF2012-AL adds an aluminum shroud to
provide increased durability. Both types of probes connect to our ZIF-Clip®
headstage. When determining insertion spacing between two or more arrays, be sure
to consider the headstage dimensions to ensure sufficient clearance.
Note: This section provides information specific to TDT arrays. For more general information
see "Suggestions for Microwire Insertion" on page 13-11.
Connecting to a Headstage
A notch at the base of the array facilitates proper connection to the ZIF-Clip®
headstage and can help the user identify the correct mapping of electrodes. Ensure
that the notch side is properly aligned with the arrow symbol on the headstage. See
"Adapter and Probe Connection " on page 10-4, for images and instructions.
Bonding the Arrays
After insertion, ensure acrylic or other bonding agent does not come into direct
contact with the active circuitry. Bonding agents can cause permanent damage to the
array. There should be no bonding agent closer than 10.5 mm to the base.
ZIF-Clip® Based Microwire Arrays