Device specifications
Communication interface modules (S500) > Compatibility of communication modules and communication interface modules
1.7 Communication interface modules (S500)
1.7.1 Compatibility of communication modules and communication interface modules
Table 130: Modbus TCP
Communication
Communication
module
interface
module
Onboard
CI521-MODTCP
Ethernet inter-
CI522-MODTCP
face
616
Hot swap
System requirements for hot swapping of I/O modules:
–
Types of terminal units that support hot swapping of I/O modules have the
appendix TU5xx-H.
–
I/O modules as of index F0.
The following I/O bus masters support hot swapping of attached I/O modules:
–
Communication interface modules CI5xx as of index F0.
–
Processor modules PM56xx-2ETH with firmware version as of V3.2.0.
NOTICE!
Risk of damage to I/O modules!
Hot swapping is only allowed for I/O modules.
Processor modules and communication interface modules must not be removed
or inserted during operation.
Conditions for hot swapping
–
Digital outputs are not under load.
–
Input/output voltages above safety extra low voltage/
protective extra low voltages (SELV/PELV) are switched off.
–
Modules are completely plugged on the terminal unit with both snap fit
engaged before switching on loads or input/output voltage.
Hot swap
Further information about hot swap: .
I/O expansion
module
S500
x
3ADR010278, 3, en_US
I/O expansion
I/O expansion
module
module
S500-eCo
S500-S
x
--
Applications
high availability,
remote I/O
2022/01/31