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PACKAGE OUTLINE DIMENSIONS (continued)
24
1
A
H
F
D
G
24
1
D
24X
0.010 (0.25)
–T–
SEATING
PLANE
22X
MOTOROLA CMOS LOGIC DATA
13
B
12
C
N
K
M
SEATING
PLANE
CASE 709–02
ISSUE C
–A–
13
–B–
P
12X
12
M
T
A
S
B
S
C
K
G
CASE 751E–04
ISSUE E
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
DIM
A
L
B
C
D
F
G
H
J
J
K
L
M
N
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
0.010 (0.25)
B
M
M
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
J
DIM
F
_
R
X 45
G
M
M
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
31.37
32.13
1.235
1.265
13.72
14.22
0.540
0.560
3.94
5.08
0.155
0.200
0.36
0.56
0.014
0.022
1.02
1.52
0.040
0.060
2.54 BSC
0.100 BSC
1.65
2.03
0.065
0.080
0.20
0.38
0.008
0.015
2.92
3.43
0.115
0.135
15.24 BSC
0.600 BSC
_
_
_
_
0
15
0
15
0.51
1.02
0.020
0.040
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
A
15.25
15.54
0.601
0.612
B
7.40
7.60
0.292
0.299
C
2.35
2.65
0.093
0.104
D
0.35
0.49
0.014
0.019
F
0.41
0.90
0.016
0.035
1.27 BSC
0.050 BSC
J
0.23
0.32
0.009
0.013
K
0.13
0.29
0.005
0.011
_
_
_
_
0
8
0
8
P
10.05
10.55
0.395
0.415
R
0.25
0.75
0.010
0.029
CHAPTER 9
9–7
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