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PACKAGE OUTLINE DIMENSIONS (continued)
B
18
B
1
F
18X
C
K
N
D
18X
0.25 (0.010)
24
1
A
F
D
G
CHAPTER 9
9–6
A
A
10
9
SEATING
T
PLANE
G
M
T
A
CASE 726B–01
ISSUE O
(REPLACES 726–04)
13
B
12
SEATING
PLANE
C
N
K
CASE 623–05
ISSUE M
OPTIONAL LEAD
CONFIGURATION (1, 9, 10, 18)
L
M
J
18 PL
0.25 (0.010)
M
T
B
NOTES:
1. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
2. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION (WHEN FORMED
PARALLEL).
DIM
A
B
C
D
F
G
J
K
L
M
L
N
J
M
MOTOROLA CMOS LOGIC DATA
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F FOR FULL LEADS. HALF
LEADS OPTIONAL AT LEAD POSITIONS 1, 9,
10, AND 18.
INCHES
MILLIMETERS
DIM
MIN
MAX
MIN
MAX
A
0.880
0.910
22.35
23.11
B
0.240
0.295
6.10
7.49
C
–––
0.200
–––
5.08
D
0.015
0.021
0.38
0.53
F
0.055
0.070
1.40
1.78
G
0.100 BSC
2.54 BSC
J
0.008
0.012
0.20
0.30
K
0.125
0.170
3.18
4.32
L
0.300 BSC
7.62 BSC
_
_
_
_
M
0
15
0
15
N
0.020
0.040
0.51
1.02
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
31.24
32.77
1.230
1.290
12.70
15.49
0.500
0.610
4.06
5.59
0.160
0.220
0.41
0.51
0.016
0.020
1.27
1.52
0.050
0.060
2.54 BSC
0.100 BSC
0.20
0.30
0.008
0.012
3.18
4.06
0.125
0.160
15.24 BSC
0.600 BSC
_
_
_
_
0
15
0
15
0.51
1.27
0.020
0.050
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