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PACKAGE OUTLINE DIMENSIONS (continued)
–A–
16
1
F
H
G
–A–
16
1
G
–T–
SEATING
PLANE
D
16 PL
0.25 (0.010)
CHAPTER 9
9–4
9
B
8
C
S
SEATING
–T–
PLANE
K
J
D
16 PL
0.25 (0.010)
T
A
M
M
CASE 648–08
ISSUE R
9
–B–
P
8 PL
0.25 (0.010)
8
K
C
M
T
B
A
M
S
S
CASE 751B–05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
L
A
B
C
D
F
G
H
M
J
K
L
M
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
B
M
S
5. DIMENSION D DOES NOT INCLUDE DAMBAR
F
_
R
X 45
J
MOTOROLA CMOS LOGIC DATA
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
0.740
0.770
18.80
19.55
0.250
0.270
6.35
6.85
0.145
0.175
3.69
4.44
0.015
0.021
0.39
0.53
0.040
0.70
1.02
1.77
0.100 BSC
2.54 BSC
0.050 BSC
1.27 BSC
0.008
0.015
0.21
0.38
0.110
0.130
2.80
3.30
0.295
0.305
7.50
7.74
_
_
_
_
0
10
0
10
0.020
0.040
0.51
1.01
Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM
MIN
MAX
MIN
MAX
A
9.80
10.00
0.386
0.393
B
3.80
4.00
0.150
0.157
C
1.35
1.75
0.054
0.068
D
0.35
0.49
0.014
0.019
F
0.40
1.25
0.016
0.049
G
1.27 BSC
0.050 BSC
J
0.19
0.25
0.008
0.009
K
0.10
0.25
0.004
0.009
_
_
_
_
M
0
7
0
7
P
5.80
6.20
0.229
0.244
R
0.25
0.50
0.010
0.019
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