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The standard package availability for each device is indicated on the front page of the individual data sheets. Dimensions for
the packages are given in this chapter. Surface mount packages may be special ordered by specifying the following suffixes: "D"
(narrow SOIC), "DW" (wide SOIC), or "FN" (PLCC). For example, to order a quad NOR gate, use MC14001BD.
–A–
14
1
–T–
SEATING
PLANE
F
G
D
14 PL
0.25 (0.010)
14
1
N
–T–
SEATING
PLANE
H
CHAPTER 9
9–2
PACKAGE DIMENSIONS
9
–B–
7
C
K
N
M
T
A
S
CASE 632–08
ISSUE Y
8
B
7
A
F
C
K
G
D
14 PL
0.13 (0.005)
M
CASE 646–06
ISSUE M
NOTES:
L
M
J
14 PL
0.25 (0.010)
T
B
M
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
L
C
D
F
G
H
J
K
L
J
M
M
N
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
INCHES
MILLIMETERS
DIM
MIN
MAX
MIN
MAX
A
0.750
0.785
19.05
19.94
B
0.245
0.280
6.23
7.11
C
0.155
0.200
3.94
5.08
D
0.015
0.020
0.39
0.50
F
0.055
0.065
1.40
1.65
G
0.100 BSC
2.54 BSC
J
0.008
0.015
0.21
0.38
K
0.125
0.170
3.18
4.31
L
0.300 BSC
7.62 BSC
_
_
_
_
M
0
15
0
15
N
0.020
0.040
0.51
1.01
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
0.715
0.770
18.16
18.80
0.240
0.260
6.10
6.60
0.145
0.185
3.69
4.69
0.015
0.021
0.38
0.53
0.040
0.070
1.02
1.78
0.100 BSC
2.54 BSC
0.052
0.095
1.32
2.41
0.008
0.015
0.20
0.38
0.115
0.135
2.92
3.43
0.290
0.310
7.37
7.87
_
_
–––
10
–––
10
0.015
0.039
0.38
1.01
MOTOROLA CMOS LOGIC DATA
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