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X
D
Y
LASER MARK FOR PIN A1
IDENTIFICATION IN
THIS AREA
E
0.20
16
15
14
13
12
11
10
S
e
15X
VIEW M-M
Figure 32-2. 256 MAPBGA Package Dimensions
32.2 Ordering Information
Motorola Part
Number
MCF5280CVF66
MCF5280 RISC Microprocessor, 256 MAPBGA
MCF5280CVF80
MCF5280 RISC Microprocessor, 256 MAPBGA
MCF5281CVF66
MCF5281 RISC Microprocessor, 256 MAPBGA
MCF5281CVF80
MCF5281 RISC Microprocessor, 256 MAPBGA
MCF5282CVF66
MCF5282 RISC Microprocessor, 256 MAPBGA
MCF5282CVF80
MCF5282 RISC Microprocessor, 256 MAPBGA
MOTOROLA
M
K
M
e
15X
S
METALIZED MARK FOR
PIN A1 IDENTIFICATION
IN THIS AREA
7
6
5
4
3
2
1
A
B
C
D
E
F
b
G
256X
H
J
0.25
K
L
0.10
M
N
P
R
T
Table 32-2. Orderable Part Numbers
Description
Chapter 32. Mechanical Data
A2
A
A1
Z
ROTATED 90 CLOCKWISE
3
Z
X
Y
M
Z
M
Speed
66.67 MHz
80 MHz
66.67 MHz
80 MHz
66.67 MHz
80 MHz
Ordering Information
256X
4
0.15
Z
DETAIL K
°
NOTES:
1.
DIMENSIONS ARE IN MILLIMETERS.
2.
INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3.
DIMENSION b IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
4.
DATUM Z (SEATING PLANE) IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
5.
PARALLELISM MEASUREMENT SHALL
MILLIMETERS
DIM MIN
MAX
A
1.25
1.60
A1
0.27
0.47
A2
1.16 REF
b
0.40
0.60
D
17.00 BSC
E
17.00 BSC
e
1.00 BSC
S
0.50 BSC
Temperature
°
°
-40
to +85
°
°
-40
to +85
°
°
-40
to +85
°
°
-40
to +85
°
°
-40
to +85
°
°
-40
to +85
5
0.30
Z
C
C
C
C
C
C
32-7
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