Pin Arrangement And Functions; Pin Arrangement - Renesas H8 Series Hardware Manual

8-bit single-chip microcomputer

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Pin Arrangement and Functions

The H8/38024 Group, H8/38024R Group, H8/38024S Group, and H8/38124 Group pin

arrangements are shown in figures 1.2, 1.3, and 1.4. The bonding pad location diagram of the

HCD64338024, HCD64338023, HCD64338022, HCD64338021, and HCD64338020 is shown in

figure 1.5. The bonding pad coordinates of the HCD64338024, HCD64338023, HCD64338022,

HCD64338021, and HCD64338020 are given in table 1.2. The bonding pad location diagram of

the HCD64F38024, HCD64F38024R is shown in figure 1.6. The bonding pad coordinates of the

HCD64F38024 are given in table 1.3. The bonding pad location diagram of the HCD64338024S,

HCD64338023S, HCD64338022S, HCD64338021S, and HCD64338020S is shown in figure 1.7.

The bonding pad coordinates of the HCD64338024S, HCD64338023S, HCD64338022S,

HCD64338021S, and HCD64338020S are given in table 1.4.

Note: If the on-chip emulator is used, pins 95, 33, 34, and 35 are reserved for the emulator and not available to the user.

Figure 1.2(1) Pin Arrangement (FP-80A, TFP-80C: Top View,

H8/38024 Group, H8/38024R Group, H8/38024S Group)

FP-80A, TFP-80C

Rev. 7.00 Mar 10, 2005 page 9 of 652

Section 1 Overview

REJ09B0042-0700