Renesas H8 Series Hardware Manual page 59

79
80 78
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
22
21 23
Figure 1.7 Bonding Pad Location Diagram of HCD64338024S, HCD64338023S,
HCD64338022S, HCD64338021S, and HCD64338020S (Top View)
77 75 73 71
76 74 72 70
Y
(0.0)
24 26 28 30
25 27 29 31
69 67 65 63
68 66 64 62
X
32 34 36 38
33 35 37 39
Chip size: 2.91 mm × 2.91 mm
Voltage level on the back of the chip: GND
Rev. 7.00 Mar 10, 2005 page 17 of 652
Section 1 Overview
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
REJ09B0042-0700