Renesas H8 Series Hardware Manual page 691

8-bit single-chip microcomputer

Hide thumbs Also See for H8 Series:

Table of Contents

Appendix H Form of Bonding Pads

The form of the bonding pads for the HCD64338024, HCD64338023, HCD64338022,

HCD64338021, HCD64338020, HCD64F38024, HCD64F38024R, HCD64338024S,

HCD64338023S, HCD64338022S, HCD64338021S, and HCD64338020S is shown in figure H.1.

Figure H.1 Bonding Pad Form

Appendix H Form of Bonding Pads

Bonding area

Rev. 7.00 Mar 10, 2005 page 649 of 652

REJ09B0042-0700