Renesas H8 Series Hardware Manual page 55

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Figure 1.5 Bonding Pad Location Diagram of HCD64338024, HCD64338023,
HCD64338022, HCD64338021, and HCD64338020 (Top View)
79 77 75 73 71
78 76 74 72
(0, 0)
24 26 28 30 32
25 27 29 31
69 67 65
70 68 66 64
Type code
Y
X
34 36 38
33 35 37 39
Chip size: 3.99 mm × 3.99 mm
Voltage level on the back of the chip: GND
Rev. 7.00 Mar 10, 2005 page 13 of 652
Section 1 Overview
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REJ09B0042-0700