Renesas H8 Series Hardware Manual page 57

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Figure 1.6 Bonding Pad Location Diagram of HCD64F38024, HCD64F38024R (Top View)
79 77 75 73
80 78 76 74
(0, 0)
26 28 30 32 34 36 38
25 27 29 31 33
71 69 67 65
72 70 68 66
Y
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Type code
40
35 37 39
Chip size: 3.84 mm × 4.24 mm
Voltage level on the back of the chip: GND
: NC pad
Rev. 7.00 Mar 10, 2005 page 15 of 652
Section 1 Overview
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REJ09B0042-0700